EEVision Website -- LED package inspection system specifications
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LED package inspection system specifications
Item
Defect Name
Image
Spec
Package
No Package
Broken / Burr
FM
Chip
No Chip
can't have
Ink Chip
6μm*6μm(on the Pad)
80μm*80μm
Flip
10°
Offset
80μm
Rotation
10°
Broken
16μm
Epoxy (Outer)
no
Epoxy (Inner)
6μm
Epoxy (Inner)
6μm
Micro Crack
6μm
Scratch
40μm*40μm(on the Pad)
80μm*80μm(lighten area)
FM
80μm*80μm
Broken on Finger
6μm
Gold
16μm*16μm
No Ball
can't have
Offset
in the pad
Diameter
in the pad
Wire
Ball Thick
13.5μm~22.5μm
No Wire
can't have
Open or Lift
can't have
Wrong
can't have
Tail
no
Bent
25μm
Double
can't have
Broken
can't have
Stain
can't have
short
can't have
FM
no
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